Administration & Marketing Nov 21

Dd6A3000303Nsns-Heat Sink For Artix-7 Fpga, High Performance Maxiflow With Thermal Tape Attachment,

MINISTRY OF COMMUNICATIONS - DEPARTMENT OF TELECOMMUNICATIONS (DOT)
India
Deadline: Nov 21, 2026 12:00 AM
Ref: GB-GEM/2026/B/8253268 · 0 views · Published: Nov 7, 2026
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Tender Details

Dd6A3000303Nsns-Heat Sink For Artix-7 Fpga, High Performance Maxiflow With Thermal Tape Attachment, Quantity: 430 Start Date: 07-11-2026 1:15 PM End Date: 21-11-2026 2:00 PM Ministry of Communica...

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