Dd6A3000303Nsns-Heat Sink For Artix-7 Fpga, High Performance Maxiflow With Thermal Tape Attachment,
By: MINISTRY OF COMMUNICATIONS - DEPARTMENT OF TELECOMMUNICATIONS (DOT)📍 IndiaOpen
Key Information
| Reference | GB-GEM/2026/B/8253268 |
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| Deadline | Nov 21, 2026 12:00 AM |
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| Category | Administration & Marketing |
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| Competition Type | NCB |
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| Funding Source | Self-Funded |
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| Country | India |
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| Address | Country: India |
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| Published | Nov 7, 2026 |
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Description
Dd6A3000303Nsns-Heat Sink For Artix-7 Fpga, High Performance Maxiflow With Thermal Tape Attachment, Quantity: 430 Start Date: 07-11-2026 1:15 PM End Date: 21-11-2026 2:00 PM Ministry of Communica...
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