Diamond Substrate

By: Teigh Cheyney๐Ÿ“ United StatesOpen

Key Information

ReferenceGB-N0017326Q0401
DeadlineSep 28, 2026 12:00 AM
Competition TypeICB
Funding SourceSelf-Funded
CountryUnited States
Address4555 Overlook Ave Sw,None,Washington,Dc-20375-5328Contact Person: Teigh Cheyney2028750000, Country:- United States of America
PublishedSep 23, 2026

Description

Diamond Substrate <p>Please review <strong>AND COMPLETE</strong> the attached RFQ and sign it. I will not accept any quotes without the completed RFQ.</p>

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