Soldering Fulx Paste Ram,Soldering Soft Hardness,De Soldering Wick,Rechargeable Bty,Contact Cleaner
By: MINISTRY OF DEFENCE - DEPARTMENT OF MILITARY AFFAIRS📍 IndiaOpen
Key Information
| Reference | GB-GEM/2026/B/7981110 |
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| Deadline | Sep 12, 2026 12:00 AM |
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| Competition Type | NCB |
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| Funding Source | Self-Funded |
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| Country | India |
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| Address | Country: India |
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| Published | Sep 1, 2026 |
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Description
Soldering Fulx Paste Ram,Soldering Soft Hardness,De Soldering Wick,Rechargeable Bty,Contact Cleaner Quantity: 60 Start Date: 01-09-2026 11:48 AM End Date: 12-09-2026 12:00 PM Ministry of Defence ...
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