Motherboard H510H6 M2,Motherboard B560H6 M7,Pressure Roller,Teflon Sleeve,Random Access Memory Ram

By: MINISTRY OF DEFENCE - DEPARTMENT OF MILITARY AFFAIRS๐Ÿ“ IndiaOpen

Key Information

ReferenceGB-GEM/2026/B/7963759
DeadlineSep 5, 2026 12:00 AM
Competition TypeNCB
Funding SourceSelf-Funded
CountryIndia
AddressCountry: India
PublishedAug 26, 2026

Description

Motherboard H510H6 M2,Motherboard B560H6 M7,Pressure Roller,Teflon Sleeve,Random Access Memory Ram Quantity: 6 Start Date: 26-08-2026 1:26 PM End Date: 05-09-2026 2:00 PM Ministry of Defence - D...

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