Ohmic Device,Pn Junction,Heat Shrink Sleeve Size 4Mm,Heat Shrink Sleeve Size 8Mm,Tin-Lead Alloy Sol
By: MINISTRY OF DEFENCE - DEPARTMENT OF MILITARY AFFAIRS📍 IndiaOpen
Key Information
| Reference | GB-GEM/2026/B/7928438 |
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| Deadline | Aug 31, 2026 12:00 AM |
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| Competition Type | NCB |
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| Funding Source | Self-Funded |
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| Country | India |
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| Address | Country: India |
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| Published | Aug 21, 2026 |
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Description
Ohmic Device,Pn Junction,Heat Shrink Sleeve Size 4Mm,Heat Shrink Sleeve Size 8Mm,Tin-Lead Alloy Sol Quantity: 3765 Start Date: 21-08-2026 8:19 AM End Date: 31-08-2026 9:00 AM Ministry of Defence ...
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