Thermal Conductivity Setup With Creep Sustained Load Frame
By: MINISTRY OF EDUCATION - DEPARTMENT OF HIGHER EDUCATION📍 IndiaOpen
Key Information
| Reference | GB-GEM/2026/B/8263959 |
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| Deadline | Dec 5, 2026 12:00 AM |
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| Category | Administration & Marketing |
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| Competition Type | NCB |
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| Funding Source | Self-Funded |
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| Country | India |
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| Address | Country: India |
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| Published | Nov 13, 2026 |
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Description
Thermal Conductivity Setup With Creep Sustained Load Frame Quantity: 1 Start Date: 13-11-2026 5:44 PM End Date: 05-12-2026 10:00 AM Ministry of Education - Department of Higher Education
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