High Temperature Adhesive: Part-A Resin,High Temperature Adhesive: Part-B Hardener
By: MINISTRY OF DEFENCE - DEPARTMENT OF DEFENCE RESEARCH & DEVELOPMENT📍 IndiaOpen
Key Information
| Reference | GB-GEM/2026/B/8228092 |
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| Deadline | Dec 3, 2026 12:00 AM |
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| Category | Administration & Marketing |
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| Competition Type | NCB |
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| Funding Source | Self-Funded |
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| Country | India |
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| Address | Country: India |
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| Published | Nov 12, 2026 |
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Description
High Temperature Adhesive: Part-A Resin,High Temperature Adhesive: Part-B Hardener Quantity: 400 Start Date: 12-11-2026 11:27 AM End Date: 03-12-2026 12:00 PM Ministry of Defence - Department of ...
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