Globaltendercategory (Wirebond Removal For Bga Packaged Semiconductor Chips)
By: MINISTRY OF ELECTRONICS AND INFORMATION TECHNOLOGY - DEPARTMENT OF ELECTRONICS AND INFORMATION TECHNOLOGY📍 IndiaOpen
Key Information
| Reference | GB-GEM/2026/B/8257085 |
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| Deadline | Nov 27, 2026 12:00 AM |
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| Category | Administration & Marketing |
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| Competition Type | NCB |
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| Funding Source | Self-Funded |
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| Country | India |
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| Address | Country: India |
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| Published | Nov 12, 2026 |
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Description
Globaltendercategory (Wirebond Removal For Bga Packaged Semiconductor Chips) Quantity: 1 Start Date: 12-11-2026 10:52 AM End Date: 27-11-2026 11:00 AM Ministry of Electronics and Information Tech...
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